KLA Tencor TeraScan cutaway

Deep ultraviolet (DUV) reticle inspection system.

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Tencor TeraScan reticle inspection

KLA Tencor TeraScan

Deep Ultraviolet (DUV) Reticle Inspection System used in Silicon Chip (wafer fab) Manufacturing
TeraScan detail

Image Data

  • Client: KLA Tencor Milpitas, CA
  • Agency: N/A
  • Format: Digital (Illustrator & Photoshop)
  • Use: Collateral
  • Photography: N/A
  • Alt. View: TeraStar 5XX

KLA Tencor's TeraScan is a defect detection scanner that evaluates masks, or 'reticles' used in the microelectronics and semiconductor fabrication (wafer fab) process, insuring that they are error-free. The TeraScan in this cutaway illustration uses a detection method known as 'deep ultraviolet' (DUV) reticle inspection to evaluate various reticle types such as embedded phase shift, chrome-on-glass or alternating phase shift reticles which may contain quartz defects. KLA-Tencor Corporation is located in Milpitas, California.

All Images Copyright © Kevin Hulsey, Kevin Hulsey Illustration, Inc. (KHulsey.com), all rights reserved.